Understanding Flip-Chip and Chip-Scale Package Technologies ...
2007年4月18日 · The wafer level package (flip chip and UCSP) represents a unique packaging form factor that might not perform equally to a packaged product through traditional mechanical reliability tests. The package's reliability is integrally linked to the user's assembly methods, circuit-board material, and usage environment.
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Thermal Considerations for a UCSP Package | Analog Devices
The UCSP is a packaging technology that eliminates the traditional plastic package used to encapsulate integrated circuits (ICs). Soldering the silicon directly to a PCB saves board space, but at the sacrifice of some of the advantages of a traditional package, especially heat dissipation.
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UCSP: Micro (μ) or Ultra Chip Scale Package (CSP) | MADPCB
2021年10月26日 · What’s UCSP Package? Micro (μ) or Ultra Chip Scale Package (UCSP) is a packaging technology that eliminates the traditional plastic package used to encapsulate integrated circuits (ICs).
PCB technology UCSP package device pad design
2021年10月24日 · The UCSP package structure surface provides electrical isolation. A photographic method is used to make vias on the BCB film, through which the electrical connection with the IC connection substrate can be realized.
CSP | Analog Devices
Chip Scale Package (UCSP or CSP) is an IC packaging technology in which solder balls take the place of pins, making the smallest package available. When heated, the solder balls alloy to matching pads on the circuit board.