In particular, presentations highlight both the advances and future challenges associated with multilevel interconnect. The latest developments in the integration of copper-based metallization with ...

Leading-edge advanced metallization schemes, as applied to VLSI interconnects, include the introduction of novel metals systems and novel dielectric materials. Technological advances highlighted at ...

The cells were tested over a seven-week period. The cell fabricated with copper metallization showed an efficiency of 5.61%, and that based on gold, 5.92%. These efficiencies were tested over a ...